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Corfin Industries prevents catastrophic failure in mission and life critical systems by eliminating the risks associated with tin whiskers and gold embrittlement on microelectronics component leads and terminations, a condition often associated with the commercial use of pure tin solder and gold finishes. We pioneered our core technology, Robotic Hot Solder Dip (RHSD), in the 1980's and today serve major OEMs and their subcontractors around the world in multiple high-reliability industries, such as defense, aerospace, space, medical, telecommunications, transportation and industrial. Our RHSD process, administered to exacting tolerances that exceed the GEIA-STD-0006 industry standard and maintain repeatability in a high-volume manufacturing environment, removes the tin whisker risk, restores solder joint reliability and refinishes the parts to demanding high-reliability industry standards. In addition to RHSD services, Corfin Industries also offers expertise in BGA Reballing services, Corfin Industries’ facility is AS9100D and ISO 9001 certified, ITAR registered and cleared for Class 0 Electrostatic Discharge (ESD) processing.